HP PAVILION DV8 Informações Técnicas descarregar pdf (Página 96)

4–62 Maintenance and Service Guide

Removal and replacement procedures

✎

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system

board each time the fan/heat sink assembly is removed:

■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.

■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.

■ Thermal pads are used on various other system board components 5 and 7, and heat sink sections 6 and 8

that service them.

Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare

part kits.

Reverse this procedure to install the fan/heat sink assembly.

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HP PAVILION DV8 Informações Técnicas Página 96