HP ProLiant Generation ML310 Especificações Página 55

  • Descarregar
  • Adicionar aos meus manuais
  • Imprimir
Vista de página 54
Removal and replacement procedures 55
c.
Remove the heatsink from the processor backplate.
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,
especially the contact area.
9. Open the processor locking lever, and then open the processor retaining bracket.
10. Grasp the processor by the edges, and then lift it out of the socket.
11. Remove all DIMMs ("Removing a DIMM" on page 39).
12. Remove all expansion boards ("Expansion board" on page 44).
13. If installed, remove the dedicated iLO module ("Dedicated iLO management port" on page 50).
14. Disconnect all cables connected to the system board.
15. Remove the system board:
a. Remove the system board screws.
Vista de página 54
1 2 ... 50 51 52 53 54 55 56 57 58 59 60 ... 90 91

Comentários a estes Manuais

Sem comentários