HP TouchSmart Informações Técnicas descarregar pdf (Página 73)

3. Remove the fan/heat sink assembly (3).

NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink

assembly and system board components, it may be necessary to move the fan/heat sink assembly

from side to side to detach the assembly.

NOTE: The thermal material should be thoroughly cleaned from the surfaces of the fan/heat sink

assembly (1) and the system board components (2) each time the fan/heat sink assembly is removed.

Replacement thermal material is included with all system board, fan/heat sink assembly, and processor

spare part kits.

Reverse this procedure to install the fan/heat sink assembly.

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HP TouchSmart Informações Técnicas Página 73