System Configuration
System ConfigurationSystem Configuration
System Configuration
(High-end)
Processor Info
Processor InfoProcessor Info
Processor Info
Intel Xeon Processor X3470 2.93 GHz
Memory Info
Memory InfoMemory Info
Memory Info
2 x 2GB DDR3 1333 MHz
Graphics Info
Graphics InfoGraphics Info
Graphics Info
NVIDIA Quadro FX 1800
Disks/Optical/Floppy
Disks/Optical/FloppyDisks/Optical/Floppy
Disks/Optical/Floppy
3 x 300GB 10K rpm SATA/ DVD-ROM/ 16X DVD+RW SuperMulti
Declared Noise Emissions
Declared Noise EmissionsDeclared Noise Emissions
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Sound Power
Sound PowerSound Power
Sound Power
( LWAd, bels )
Idle
3.6 Bels (20 dB)
Hard drive Operating
(random reads)
4.0 Bels (22 dB)
Floppy Drive Operating
(continuous copy)
DVD-ROM Operating
(sequential reads)
4.7Bels (32 dB)
Environmental
EnvironmentalEnvironmental
Environmental
Requirements
RequirementsRequirements
Requirements
Temperature
TemperatureTemperature
Temperature
Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Humidity
HumidityHumidity
Humidity
Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Maximum Altitude
Maximum AltitudeMaximum Altitude
Maximum Altitude
Operating: 3,000 m (10,000 ft)
Non-operating: 9,100 m (30,000 ft)
Dynamic
DynamicDynamic
Dynamic
(new)
Shock
Operating: ½-sine: 40g, 2-3ms
Non-operating:
½-sine: 160 cm/s, 2-3ms (~100g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz
Non-operating random: 2.0g (rms), 10-500 Hz
NOTES:
NOTES:NOTES:
NOTES:
Values represent individual shock events and do not indicate
repetitive shock events.Values do not indicate continuous vibration.
Cooling
CoolingCooling
Cooling
Above 1524 m (5,000 ft) altitude, maximum operating temperature is de-
rated by 1.8° F (1° C) per 305 m (1000 ft) elevation increase
Physical Security and Serviceability
Physical Security and ServiceabilityPhysical Security and Serviceability
Physical Security and Serviceability
Access Panel
Access PanelAccess Panel
Access Panel
Tool-less
Includes system board and memory information
Optical Drive
Optical DriveOptical Drive
Optical Drive
Tool-less
Floppy Drive
Floppy DriveFloppy Drive
Floppy Drive
Tool-less
Hard Drives
Hard DrivesHard Drives
Hard Drives
Tool-less
Expansion Cards
Expansion CardsExpansion Cards
Expansion Cards
Tool-less
Processor Socket
Processor SocketProcessor Socket
Processor Socket
Tool-less
Green User Touch Points
Green User Touch PointsGreen User Touch Points
Green User Touch Points
Yes, on tool-free internal chassis mechanisms
QuickSpecs
HP Z200 Workstation
HP Z200 WorkstationHP Z200 Workstation
HP Z200 Workstation
System Technical Specifications
DA - 13541 Worldwide — Version 18 — July 1, 2011
Page 18
(26 páginas)
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