HP Proliant DL580 Guia do Utilizador Página 96
- Página / 127
- Índice
- RESOLUÇÃO DE PROBLEMAS
- MARCADORES
- HP ProLiant DL580 G7 Server 1
- User Guide 1
- Intended audience 2
- Contents 3
- Component identification 7
- Front panel LEDs and buttons 8
- Systems Insight Display 9
- Rear panel components 10
- Rear panel LEDs and buttons 11
- Power supply LED 12
- System board components 13
- System maintenance switch 14
- SPI board components 15
- Component identification 17 17
- DIMM slot locations 18
- Device numbers 18
- Hard drive LEDs 19
- Hard drive LED combinations 19
- Battery pack LEDs 20
- FBWC module LEDs 22
- Fan locations 23
- Item Description 24
- Operations 25
- Remove the access panel 26
- Remove the SPI board 28
- Rack planning resources 30
- Optimum environment 31
- Power requirements 32
- Rack warnings 33
- Installing hardware options 33
- Registering the server 34
- Introduction 35
- Processor options 35
- Memory options 41
- DIMM identification 42
- DIMM installation guidelines 42
- Hemisphere mode 45
- Memory RAS 47
- Installing memory 49
- Hot-plug hard drive option 51
- Expansion board options 55
- Cabling 72
- Configuration tools 73
- HP ROM-Based Setup Utility 73
- Using RBSU 74
- Auto-configuration process 74
- Boot options 75
- BIOS Serial Console 75
- Configuring lockstep memory 75
- Array Configuration Utility 76
- Management tools 78
- Erase Utility 79
- HP Systems Insight Manager 80
- Management Agents 80
- Redundant ROM support 80
- Diagnostic tools 81
- Integrated Management Log 82
- Array Diagnostic Utility 82
- Keeping the system current 83
- Care Pack 84
- Troubleshooting 85
- Symbols on equipment 86
- Warnings and cautions 86
- Symptom information 87
- Loose connections 88
- Service notifications 89
- Troubleshooting flowcharts 89
- General diagnosis flowchart 90
- Symptoms: 92
- Troubleshooting 94 94
- POST problems flowchart 95
- OS boot problems flowchart 96
- • Redundancy failure 99
- Troubleshooting 100 100
- Battery replacement 101
- FCC rating label 102
- Class A equipment 102
- Class B equipment 102
- Modifications 103
- • EMC Directive 2004/108/EC 104
- Japanese notice 105
- BSMI notice 105
- Korean notice 106
- Chinese notice 106
- Laser compliance 106
- Battery replacement notice 106
- (Geräuschemission) 107
- Wireless devices 108
- Taiwan notices 109
- Electrostatic discharge 110
- Specifications 111
- Specification Value 112
- Technical support 113
- Technical support 114 114
- Customer Self Repair 115
- Technical support 116 116
- Reparo feito pelo cliente 117
- Technical support 118 118
- Technical support 119 119
- Technical support 120 120
- Acronyms and abbreviations 121
- Index 124 124
- Index 125 125
- Index 126 126
- Index 127 127
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