Hp BL685C G6 Manual do Utilizador Página 49
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Hardware options installation 49
Enabling the TPM requires accessing the ROM-Based Setup Utility (RBSU) ("HP ROM-Based Setup
Utility" on page 63). For more information about RBSU, see the HP website
(http://www.hp.com/support/smartstart/documentation
).
TPM installation requires the use of drive encryption technology, such as the Microsoft® Windows®
BitLocker™ Drive Encryption feature. For more information on BitLocker™, see the Microsoft website
(http://www.microsoft.com
).
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines
can cause hardware damage or halt data access.
When installing or replacing a TPM, observe the following guidelines:
• Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system
board.
• When installing or replacing hardware, HP service providers cannot enable the TPM or the
encryption technology. For security reasons, only the customer can enable these features.
• When returning a system board for service replacement, do not remove the TPM from the system
board. When requested, HP Service provides a TPM with the spare system board.
• Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security
rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider
the system compromised and take appropriate measures to ensure the integrity of the system data.
• When using BitLocker™, always retain the recovery key/password. The recovery key/password is
required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.
• HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see
the encryption technology feature documentation provided by the operating system.
Installing the Trusted Platform Module board
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
1. Power down the server blade (on page 15).
2. Remove the server blade (on page 16).
3. Place the server blade on a flat, level work surface.
4. Remove the access panel (on page 17).
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM,
administrators should consider the system compromised and take appropriate measures to
ensure the integrity of the system data.
- User Guide 1
- Intended audience 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- SAS and SATA hard drive LEDs 8
- System board components 10
- DIMM slots 11
- • Processor 4 DIMM slots 12
- • Processor 3 DIMM slots 12
- System maintenance switch 13
- HP c-Class Blade SUV Cable 14
- Operations 15
- Remove the server blade 16
- Remove the access panel 17
- Install the access panel 17
- Remove the SAS hard drive 17
- Remove the solid state drive 17
- Remove the DIMM baffle 18
- Install the DIMM baffle 19
- Overview 21
- Remove the device bay blank 22
- Setup 23 23
- Setup 27 27
- Connecting to the network 28
- Installing a server blade 29
- Completing the configuration 30
- Introduction 31
- Processor option 31
- Memory option 37
- DIMM installation guidelines 38
- DIMM population order 38
- Installing DIMMs 38
- Solid state drive option 39
- Install the SSD 40
- Mezzanine card option 41
- SAS controller option 43
- Remove the hard drive blank 45
- Prepare the hard drive 45
- BBWC battery option 46
- Cabling 52
- USB devices 53
- Item Description 55
- Network-based PXE deployment 57
- Deployment infrastructure 58
- Deployment methods 59
- CD-ROM deployment 60
- Diskette image deployment 61
- Configuration tools 62
- HP ROM-Based Setup Utility 63
- Array Configuration Utility 64
- Management tools 66
- HP Systems Insight Manager 67
- Management Agents 67
- Redundant ROM support 70
- Diagnostic tools 71
- Integrated Management Log 72
- Array Diagnostic Utility 72
- Keeping the system current 73
- Care Pack 74
- Troubleshooting 75
- Important safety information 76
- Symptom information 77
- Service notifications 78
- Loose connections 78
- Troubleshooting flowcharts 78
- Start diagnosis flowchart 79
- General diagnosis flowchart 80
- Symptoms: 82
- POST problems flowchart 84
- Item Refer to 85
- OS boot problems flowchart 86
- • Corrupted OS 87
- • Redundancy failure 89
- Troubleshooting 90 90
- Battery replacement 91
- FCC rating label 92
- Class A equipment 92
- Class B equipment 92
- Modifications 93
- • EMC Directive 2004/108/EC 94
- Japanese notice 95
- BSMI notice 95
- Korean notice 95
- Chinese notice 96
- Laser compliance 96
- Battery replacement notice 96
- (Geräuschemission) 97
- Electrostatic discharge 98
- Specifications 99
- Technical support 100
- Acronyms and abbreviations 101
- Index 104 104
- Index 105 105
- Index 106 106
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