Hp DL580 Manual do Utilizador Página 42
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Hardware options installation 42
Configuration Bank A
1A/5A
Bank B
9B/13B
Bank C
2C/6C
Bank D
10D/14D
Bank E
3E/7E
Bank F
11F/15F
Bank G
4G/8G
Bank H
12H/16H
5 X X X X X X X X
* Configuration 1 is only supported if bank A is populated with dual-rank FBDIMMs.
After installing FBDIMMs, use RBSU to configure the system for online spare memory support
("Configuring online spare memory" on page 66).
Mirrored memory configuration
Mirroring provides protection against uncorrectable memory errors that would otherwise result in server
downtime.
Mirroring is performed on the branch level. Branch 0 and branch 1 mirror each other.
Each branch maintains a copy of all memory contents. Memory writes go to both branches. Memory
reads come from only one of the two branches (unless an uncorrectable error occurs). If a memory read
on one branch returns incorrect data due to an uncorrectable memory error, the system automatically
retrieves the proper data from the other branch. A branch is not necessarily disabled (thus losing
mirroring protection) because of a single uncorrectable error. Mirroring protection is not lost because of
transient and soft uncorrectable errors, resulting in systems that maintain mirroring protection (and thus
improved uptime) unless there is a failure of both branches.
Mirrored memory FBDIMM configuration requirements (in addition to the general configuration
requirements):
• Banks A and B must be fully populated at a minimum.
Mirrored memory supports the following FBDIMM configurations:
Configuration Bank A
1A/5A
Bank B
9B/13B
Bank C
2C/6C
Bank D
10D/14D
Bank E
3E/7E
Bank F
11F/15F
Bank G
4G/8G
Bank H
12H/16H
1 X X
2 X X X X
3 X X X X X X
4 X X X X X X X X
After installing FBDIMMs, use RBSU to configure the system for mirrored memory support ("Configuring
mirrored memory" on page 67).
Installing FBDIMMs
1. Power down the server (on page 21).
2. Remove the processor memory module, and open the cover ("Removing the processor memory
module" on page 33).
3. Open the FBDIMM slot latches.
- User Guide 1
- Intended audience 2
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- Front panel LEDs and buttons 8
- Systems Insight Display 9
- Rear panel components 10
- Rear panel LEDs and buttons 11
- Power supply LED 12
- System board components 13
- SPI board components 14
- System maintenance switch 14
- FBDIMM slot locations 15
- SAS device numbers 16
- SAS hard drive LEDs 17
- Battery pack LEDs 18
- Fan locations 20
- Operations 21
- • Hard drives 22
- • Systems Insight Display 22
- Removing the access panel 23
- Removing the system battery 24
- Operations 25 25
- 6. Remove the battery 25
- Rack planning resources 26
- Optimum environment 27
- Power requirements 28
- Rack warnings 29
- Installing hardware options 29
- Registering the server 32
- Introduction 33
- Processor options 33
- Installing a processor 35
- Memory options 39
- Advanced ECC memory 40
- 41
- Installing FBDIMMs 42
- Installing the drive cage 45
- Remove the blank 46
- Tape drive 49
- Remove the tape drive blank 50
- Battery-backed write cache 53
- Expansion board options 57
- Cabling 61
- Hard drive cabling 62
- Tape drive cabling 63
- SATA DVD drive cabling 63
- DVD drive cabling 63
- Cabling 64 64
- Configuration tools 65
- HP ROM-Based Setup Utility 66
- Configuring mirrored memory 67
- Auto-configuration process 67
- Boot options 68
- BIOS Serial Console 68
- Array Configuration Utility 69
- Management tools 70
- HP Systems Insight Manager 71
- Management Agents 71
- Diagnostic tools 72
- Integrated Management Log 73
- Array Diagnostic Utility 73
- Keeping the system current 74
- Troubleshooting 75
- Symbols on equipment 76
- Warnings and cautions 76
- Symptom information 77
- Loose connections 78
- Service notifications 79
- Troubleshooting flowcharts 79
- General diagnosis flowchart 80
- Symptoms: 82
- Troubleshooting 84 84
- POST problems flowchart 85
- OS boot problems flowchart 86
- • Redundancy failure 89
- Troubleshooting 90 90
- FCC rating label 91
- Class A equipment 91
- Class B equipment 91
- Modifications 92
- • EMC Directive 2004/108/EC 93
- Japanese notice 94
- BSMI notice 94
- Korean notice 94
- Laser compliance 95
- Battery replacement notice 95
- (Geräuschemission) 96
- Electrostatic discharge 97
- Specifications 98
- Specification Value 99
- Technical support 100
- Acronyms and abbreviations 101
- Index 105 105
- Index 106 106
- Index 107 107
- Index 108 108
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