HP 210-1060EV Informações Técnicas descarregar pdf (Página 72)

4. Remove the fan/heat sink assembly (3).

NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink

assembly and system board components, it may be necessary to move the fan/heat sink

assembly from side to side to detach it from the system board.

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly and the system board each time the fan/heat sink assembly is removed: Thermal

paste is used on the processor (1) and the fan/heat sink assembly section (2) that services it.

Reverse this procedure to install the fan/heat sink assembly.

64 Chapter 4 Removal and replacement procedures

1 2 ... 67 68 69 70 71 72 73 74 75 76 77 ... 104 105

Sem comentários

HP 210-1060EV Informações Técnicas Página 72