HP Integrity rx2600 Especificações descarregar pdf (Página 13)

• Chipset

– HP zx1 Chipset

– 105-nanosecond memory latency

– 6.4 GB/s system bus bandwidth

– 4.0 GB/s aggregate I/O bandwidth

• Expansion slots

– 3 PCI-X on independent buses, 64-bit 133 MHz

– 6 PCI-X on 3 shared buses, 64-bit 66 MHz

– 1 PCI for graphics/USB, 64-bit 33 MHz

• Hot-plug disk drives (4 bays)

– 584 GB maximum internal storage

– 2 dual Ultra160 SCSI controllers

– Optional high-availability (duplex) configuration for internal disk drives

– Disk sizes available: 36 GB 15,000 rpm, 73 GB 15,000 rpm, 146 GB 10,000 rpm

• Removable media

– One open media bay for optional SCSI devices

– Choice of DVD-ROM or DDS-3

• Core I/O interconnect ports

– Gigabit-TX LAN with RJ-45 connector (10/100/1000BT autosensing)

– Ultra160 SCSI port for external peripherals

– Management processor interconnect

– 10/100BT management LAN with Web console access

– RS-232 local console

– RS-232 remote/modem console

– RS-232 general purpose

– 2 USB Series A 2.0 (480 Mb/s) ports (optional)

– VGA (optional)

• Power and cooling

– 2 930W hot-swap power supplies standard

– Optional third 930W hot-swap power supply for N+1 redundancy

– 8 cooling fans with N+1 redundancy

• Power requirements

– Input current: 10A at100–120V, 5A at 200–240V (voltage auto ranging)

– Line frequency: 50 Hz to 60 Hz

– Maximum power input: 1600W (conservative), 1250W (typical)

Physical and environmental specifications

• Environmental specifications

– Altitude

– Operating: 3000 m (10,000 ft.) maximum

– Storage: 4600 m (15,000 ft.) maximum

– Temperature

– Operating: +05°C to +35°C (+41°F to +95°F)

– Non-operating: –40°C to +70°C (–40°F to +158°F)

– Humidity

– Operating: 15% to 80% (relative, non-condensing)

• Physical dimensions in rack orientation

– Height: 31.1 cm (12.25 in.), 7U EIA

– Width: 48.2 cm (19 in.)

– Depth: 77.4 cm (30.5 in.)

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