HP Pavilion 403 Informações Técnicas descarregar pdf (Página 106)

Remove the fan/heat sink assembly (2). Disconnect the fan cable (3) from the system board.

NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink

assembly and system board components, it may be necessary to move the fan/heat sink assembly

from side to side to detach the assembly.

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly and the system board each time the fan/heat sink assembly is removed. Thermal paste is

used on the heat sink (1) and the processor (2). Thermal pads are used on the Northbridge

contact (3) and Northbridge chip (4), the graphics/heat sink contact (5) and graphics subsystem

chip (6), and graphics/heat sink contact (7) and capacitors (8). Replacement thermal material is

included with all fan/heat sink assembly, system board, and processor spare part kits.

4. Turn the system board upside down, with the expansion port and external monitor port toward

you.

96 Chapter 4 Removal and replacement procedures

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HP Pavilion 403 Informações Técnicas Página 106