manuais HP B6L65AV

Hp B6L65AV Ficha Técnica (172 páginas)

Marca: Hp | Categoria: Processadores | Tamanho: 2.98 MB |

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Mobile 3rd Generation Intel

1

Processor Family

1

2 Datasheet, Volume 1

2

Contents

3

4 Datasheet, Volume 1

4

Datasheet, Volume 1 5

5

6 Datasheet, Volume 1

6

Datasheet, Volume 1 7

7

8 Datasheet, Volume 1

8

Revision History

9

10 Datasheet, Volume 1

10

1 Introduction

11

Processor

12

1.1 Processor Feature Details

13

1.2 Interfaces

13

1.2.2 PCI Express*

14

Datasheet, Volume 1 15

15

Introduction

15

1.2.5 Processor Graphics

16

1.3 Power Management Support

17

1.5 Package

19

1.6 Processor Compatibility

19

1.7 Terminology

20

1.8 Related Documents

23

24 Datasheet, Volume 1

24

2 Interfaces

25

2.1.3.1 Single-Channel Mode

27

Flex Memory Technology Mode

27

Interfaces

28

28 Datasheet, Volume 1

28

2.1.5.2 Command Overlap

29

2.2 PCI Express* Interface

30

2.2.1.1 Transaction Layer

31

2.2.1.2 Data Link Layer

31

2.2.1.3 Physical Layer

31

32 Datasheet, Volume 1

32

2.2.3 PCI Express* Graphics

33

2.3.1 DMI Error Flow

34

2.3.3 DMI Link Down

34

Datasheet, Volume 1 35

35

2.4.1.2 3D Pipeline

36

2.4.1.3 Video Engine

36

2.4.1.4 2D Engine

37

2.4.2.1 Display Planes

38

2.4.2.2 Display Pipes

39

2.4.2.3 Display Ports

39

2.6 Interface Clocking

40

3 Technologies

41

Technologies

42

42 Datasheet, Volume 1

42

Datasheet, Volume 1 43

43

44 Datasheet, Volume 1

44

3.4 Intel

45

Turbo Boost Technology

45

3.5 Intel

46

Datasheet, Volume 1 47

47

3.7 Intel

48

64 Architecture x2APIC

48

Datasheet, Volume 1 49

49

50 Datasheet, Volume 1

50

4 Power Management

51

(ACPI) States Supported

52

4.2.1 Enhanced Intel

54

SpeedStep

54

Technology

54

4.2.2 Low-Power Idle States

55

4.2.4.1 Core C0 State

57

4.2.4.2 Core C1 / C1E State

57

4.2.4.3 Core C3 State

57

4.2.4.4 Core C6 State

57

4.2.4.5 Core C7 State

58

4.2.4.6 C-State Auto-Demotion

58

4.2.5.1 Package C0

60

4.2.5.2 Package C1/C1E

60

4.2.5.3 Package C3 State

60

4.2.5.4 Package C6 State

60

4.2.5.5 Package C7 State

61

Management

61

Power Management

62

62 Datasheet, Volume 1

62

Datasheet, Volume 1 63

63

4.5 DMI Power Management

65

4.6 Graphics Power Management

65

66 Datasheet, Volume 1

66

Datasheet, Volume 1 67

67

68 Datasheet, Volume 1

68

5 Thermal Management

69

5.2 Intel

70

5.3 Intel

70

System Thermal Response Time

71

Low Power Mode (LPM)

72

Thermal Management

73

Mode Description

73

Note Definition

74

Max Units Notes

76

Segment Symbol

77

Idle Parameter Min Typ Max

77

Units Notes

77

5.6.1.1 TCC Activation Offset

78

5.6.1.3 Clock Modulation

80

82 Datasheet, Volume 1

82

5.6.3.5 THERMTRIP# Signal

83

84 Datasheet, Volume 1

84

6 Signal Description

85

Table 6-8. Intel

89

Flexible Display (Intel

89

6.11 Power Sequencing Signals

92

6.12 Processor Power Signals

93

6.13 Sense Signals

93

7 Electrical Specifications

95

7.4 System Agent (SA) Vcc VID

99

7.6 Signal Groups

100

(Prior to Board Attach)

102

7.9 DC Specifications

103

Table 7-5. Processor Core (V

104

Electrical Specifications

105

Table 7-9. Processor PLL (V

106

DC Specifications

110

112 Datasheet, Volume 1

112

8 Processor Pin, Signal, and

113

Datasheet, Volume 1 125

125

126 Datasheet, Volume 1

126

144 Datasheet, Volume 1

144

Datasheet, Volume 1 145

145

160 Datasheet, Volume 1

160

Datasheet, Volume 1 161

161

162 Datasheet, Volume 1

162

Datasheet, Volume 1 163

163

164 Datasheet, Volume 1

164

Datasheet, Volume 1 165

165

166 Datasheet, Volume 1

166

Datasheet, Volume 1 167

167

168 Datasheet, Volume 1

168

9 DDR Data Swizzling

169

Table – Channel A

170

DDR Data Swizzling

172

172 Datasheet, Volume 1

172

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