HP E5440 Especificações

Consulte online ou descarregue Especificações para Processadores HP E5440. HP Intel Xeon E5450 Manual do Utilizador

  • Descarregar
  • Adicionar aos meus manuais
  • Imprimir
  • Página
    / 100
  • Índice
  • MARCADORES
  • Avaliado. / 5. Com base em avaliações de clientes
Vista de página 0
Reference Number: 318611 Revision: 001
Quad-Core Intel
®
Xeon
®
Processor
5400 Series
Thermal/Mechanical Design Guidelines
November 2007
Vista de página 0
1 2 3 4 5 6 ... 99 100

Resumo do Conteúdo

Página 1 - 5400 Series

Reference Number: 318611 Revision: 001Quad-Core Intel® Xeon® Processor 5400 SeriesThermal/Mechanical Design GuidelinesNovember 2007

Página 2

Introduction10 Quad-Core Intel® Xeon® Processor 5400 Series TMDGNote: Contact your Intel field sales representative for the latest revision and order

Página 3 - Contents

Enabled Suppliers Information100 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Página 4

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 11Introduction§TCONTROLA processor unique value for use in fan speed control mechanisms. TCONTROL is

Página 5

Introduction12 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Página 6

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 13Thermal/Mechanical Reference Design2 Thermal/Mechanical Reference DesignThis chapter describes the

Página 7 - Revision History

Thermal/Mechanical Reference Design14 Quad-Core Intel® Xeon® Processor 5400 Series TMDG2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series PackageThe Q

Página 8

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 15Thermal/Mechanical Reference DesignNote: Guidelines on potential IHS flatness variation with socke

Página 9 - 1 Introduction

Thermal/Mechanical Reference Design16 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure 2-2. Quad-Core Intel® Xeon® Processor 5400 Series Mechan

Página 10 - 1.4 Definition of Terms

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 17Thermal/Mechanical Reference DesignNote: The optional dimple packing marking highlighted by Detail

Página 11

Thermal/Mechanical Reference Design18 Quad-Core Intel® Xeon® Processor 5400 Series TMDGThe package includes an integrated heat spreader (IHS). The IHS

Página 12 - Introduction

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 19Thermal/Mechanical Reference DesignA potential mechanical solution for heavy heatsinks is the dire

Página 13 - Thermal/Mechanical Reference

2 Quad-Core Intel® Xeon® Processor 5400 Series TMDG IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS

Página 14

Thermal/Mechanical Reference Design20 Quad-Core Intel® Xeon® Processor 5400 Series TMDGprocessor operating frequency (via the bus multiplier) and inpu

Página 15

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 21Thermal/Mechanical Reference Designsmaller foot print and decreased sensitivity to noise. These DT

Página 16

Thermal/Mechanical Reference Design22 Quad-Core Intel® Xeon® Processor 5400 Series TMDG2.2.4.2 Thermal Monitor for Multiple Core ProductsThe thermal m

Página 17

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 23Thermal/Mechanical Reference DesignFigure 2-6. Processor Core Geometric Center LocationsX1, X2, X3

Página 18 - Considerations

Thermal/Mechanical Reference Design24 Quad-Core Intel® Xeon® Processor 5400 Series TMDG2.2.5 Thermal ProfileThe thermal profile is a line that defines

Página 19

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 25Thermal/Mechanical Reference Designabove, the case-to-ambient resistance represents the slope of t

Página 20 - 2.2.2 Digital Thermal Sensor

Thermal/Mechanical Reference Design26 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure 2-9 depicts the interaction between the Thermal Profile

Página 21

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 27Thermal/Mechanical Reference DesignThe Thermal Profile A is based on Intel’s 2U+ air cooling solut

Página 22

Thermal/Mechanical Reference Design28 Quad-Core Intel® Xeon® Processor 5400 Series TMDGRefer to the Quad-Core Intel® Xeon® Processor 5400 Series Datas

Página 23

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 29Thermal/Mechanical Reference DesignNotes:1. The The thermal specifications shown in this graph are

Página 24 - 2.2.5 Thermal Profile

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3Contents1Introduction...

Página 25 - Definition

Thermal/Mechanical Reference Design30 Quad-Core Intel® Xeon® Processor 5400 Series TMDGNote: The thermal specifications shown in this graph are for re

Página 26 - Processor 5400 Series

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 31Thermal/Mechanical Reference DesignTa ble 2-4 and Ta bl e 2 -5 describe the thermal performance t

Página 27

Thermal/Mechanical Reference Design32 Quad-Core Intel® Xeon® Processor 5400 Series TMDGNote: Intel does not enable reference heatsink for the Quad-Cor

Página 28 - 2.2.8 Performance Targets

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 33Thermal/Mechanical Reference Design2.4 Characterizing Cooling Solution Performance Requirements2.4

Página 29

Thermal/Mechanical Reference Design34 Quad-Core Intel® Xeon® Processor 5400 Series TMDGThere are many different ways of implementing fan speed control

Página 30

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 35Thermal/Mechanical Reference DesignThe case-to-local ambient thermal characterization parameter of

Página 31 - Y = 0.187*x + 35

Thermal/Mechanical Reference Design36 Quad-Core Intel® Xeon® Processor 5400 Series TMDGAssume the datasheet TDP is 85 W and the case temperature speci

Página 32 - 2.3 Fan Fail Guidelines

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 37Thermal/Mechanical Reference DesignTo develop a reliable, cost-effective thermal solution, thermal

Página 33 - Requirements

Thermal/Mechanical Reference Design38 Quad-Core Intel® Xeon® Processor 5400 Series TMDG2.5.2 Thermal Interface MaterialTIM application between the pro

Página 34 - Relationships

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 39Thermal/Mechanical Reference Design2.5.4 Assembly Overview of the Intel Reference Thermal Mechanic

Página 35 - 2.4.2.1 Example

4 Quad-Core Intel® Xeon® Processor 5400 Series TMDG D Safety Requirements...

Página 36

Thermal/Mechanical Reference Design40 Quad-Core Intel® Xeon® Processor 5400 Series TMDGThe CEK reference thermal solution is designed to extend air-co

Página 37

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 41Thermal/Mechanical Reference DesignCEK, are now commonly using direct chassis attach (DCA) as the

Página 38 - 2.5.3 Summary

Thermal/Mechanical Reference Design42 Quad-Core Intel® Xeon® Processor 5400 Series TMDG2.5.6 Thermal Profile AdherenceThe 2U+ CEK Intel reference ther

Página 39 - Mechanical Design

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 43Thermal/Mechanical Reference DesignThe 1U CEK Intel reference thermal solution is designed to meet

Página 40

Thermal/Mechanical Reference Design44 Quad-Core Intel® Xeon® Processor 5400 Series TMDGThe 1U CEK Intel reference thermal solution is designed to meet

Página 41

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 45Thermal/Mechanical Reference DesignNote: Intel has also developed an 1U alternative reference heat

Página 42

Thermal/Mechanical Reference Design46 Quad-Core Intel® Xeon® Processor 5400 Series TMDGNote: Refer to Appendix B for more detailed mechanical drawings

Página 43 - CASE_MAX_B

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 47Thermal/Mechanical Reference DesignAlthough the CEK heatsink fits into the legacy volumetric keep-

Página 44

Thermal/Mechanical Reference Design48 Quad-Core Intel® Xeon® Processor 5400 Series TMDG2.5.7.3 CEK SpringThe CEK spring, which is attached on the seco

Página 45 - Y = 0.298 * X + 43.2

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 49Thermal/Mechanical Reference Design2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel®Xeo

Página 46

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 5B-5 CEK Spring (Sheet 1 of 3) ...

Página 47

Thermal/Mechanical Reference Design50 Quad-Core Intel® Xeon® Processor 5400 Series TMDGClearance is required around the heatsink to ensure unimpeded a

Página 48 - Secondary

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 51Thermal/Mechanical Reference Design2.5.8.2 Systems Considerations Associated with the Active CEKTh

Página 49

Thermal/Mechanical Reference Design52 Quad-Core Intel® Xeon® Processor 5400 Series TMDGThe other items listed in Figure 2-16 that are required to comp

Página 50 - 2.5.8.1 Fan Power Supply

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 531U Alternative Heatsink Thermal/Mechanical DesignA1U Alternative Heatsink Thermal/Mechanical Desig

Página 51

1U Alternative Heatsink Thermal/Mechanical Design54 Quad-Core Intel® Xeon® Processor 5400 Series TMDGA.2 Thermal Solution Performance CharactericsFigu

Página 52

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 551U Alternative Heatsink Thermal/Mechanical Designx = Processor power value (W)Figure A-3 below sho

Página 53 - Thermal/Mechanical Design

1U Alternative Heatsink Thermal/Mechanical Design56 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Página 54 - A.3 Thermal Profile Adherence

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 57Mechanical DrawingsB Mechanical DrawingsThe mechanical drawings included in this appendix refer to

Página 55 - Y = 0.331 * X + 40

Mechanical Drawings58 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-1. 2U CEK Heatsink (Sheet 1 of 4)

Página 56

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 59Mechanical DrawingsFigure B-2. 2U CEK Heatsink (Sheet 2 of 4)

Página 57 - B Mechanical Drawings

6 Quad-Core Intel® Xeon® Processor 5400 Series TMDG Tables1-1 Reference Documents...

Página 58 - Mechanical Drawings

Mechanical Drawings60 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-3. 2U CEK Heatsink (Sheet 3 of 4)

Página 59

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 61Mechanical DrawingsFigure B-4. 2U CEK Heatsink (Sheet 4 of 4)

Página 60

Mechanical Drawings62 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-5. CEK Spring (Sheet 1 of 3)

Página 61

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 63Mechanical DrawingsFigure B-6. CEK Spring (Sheet 2 of 3)

Página 62

Mechanical Drawings64 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-7. CEK Spring (Sheet 3 of 3)

Página 63

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 65Mechanical DrawingsFigure B-8. Baseboard Keepout Footprint Definition and Height Restrictions for

Página 64

Mechanical Drawings66 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-9. Baseboard Keepout Footprint Definition and Height Restrictions for

Página 65

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 67Mechanical DrawingsFigure B-10. Baseboard Keepout Footprint Definition and Height Restrictions for

Página 66

Mechanical Drawings68 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-11. Baseboard Keepout Footprint Definition and Height Restrictions for

Página 67

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 69Mechanical DrawingsFigure B-12. Baseboard Keepout Footprint Definition and Height Restrictions for

Página 68

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 7Revision History§Reference NumberRevision NumberDescription Date318611 001 Initial release of the

Página 69

Mechanical Drawings70 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-13. Baseboard Keepout Footprint Definition and Height Restrictions for

Página 70

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 71Mechanical DrawingsFigure B-14. 1U CEK Heatsink (Sheet 1 of 4)

Página 71

Mechanical Drawings72 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-15. 1U CEK Heatsink (Sheet 2 of 4)

Página 72

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 73Mechanical DrawingsFigure B-16. 1U CEK Heatsink (Sheet 3 of 4)

Página 73

Mechanical Drawings74 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-17. 1U CEK Heatsink (Sheet 4 of 4)

Página 74

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 75Mechanical DrawingsFigure B-18. Active CEK Thermal Solution Volumetric (Sheet 1 of 3)

Página 75

Mechanical Drawings76 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-19. Active CEK Thermal Solution Volumetric (Sheet 2 of 3)

Página 76

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 77Mechanical DrawingsFigure B-20. Active CEK Thermal Solution Volumetric (Sheet 3 of 3)

Página 77

Mechanical Drawings78 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-21. 1U Alternative Heatsink (1 of 4)

Página 78

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 79Mechanical DrawingsFigure B-22. 1U Alternative Heatsink (2 of 4)

Página 79

8 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Página 80

Mechanical Drawings80 Quad-Core Intel® Xeon® Processor 5400 Series TMDGFigure B-23. 1U Alternative Heatsink (3 of 4)

Página 81

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 81Mechanical DrawingsFigure B-24. 1U Alternative Heatsink (4 of 4)

Página 82

Mechanical Drawings82 Quad-Core Intel® Xeon® Processor 5400 Series TMDG§

Página 83 - Methodology

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 83Heatsink Clip Load MethodologyC Heatsink Clip Load MethodologyC.1 OverviewThis section describes a

Página 84

Heatsink Clip Load Methodology84 Quad-Core Intel® Xeon® Processor 5400 Series TMDGAlternate Heatsink Sample PreparationAs just mentioned, making sure

Página 85 - Preload Fixture (copper

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 85Heatsink Clip Load MethodologyFigure C-2. Load Cell Installation in Machined Heatsink Base Pocket

Página 86 - C.2.3 Test Procedure Examples

Heatsink Clip Load Methodology86 Quad-Core Intel® Xeon® Processor 5400 Series TMDGC.2.2 Typical Test EquipmentFor the heatsink clip load measurement,

Página 87

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 87Heatsink Clip Load Methodology(often on the order of 3 minutes). The time zero reading should be t

Página 88

Heatsink Clip Load Methodology88 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Página 89 - D Safety Requirements

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 89Safety RequirementsD Safety RequirementsHeatsink and attachment assemblies shall be consistent wit

Página 90 - Safety Requirements

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 9Introduction1 Introduction1.1 ObjectiveThe purpose of this guide is to describe the reference therm

Página 91 - E Quality and Reliability

Safety Requirements90 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Página 92

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 91Quality and Reliability RequirementsE Quality and Reliability RequirementsE.1 Intel Verification C

Página 93

Quality and Reliability Requirements92 Quad-Core Intel® Xeon® Processor 5400 Series TMDGNote: In the case of a discrepancy, information in the most re

Página 94

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 93Quality and Reliability Requirements3. No signs of physical damage on baseboard surface due to imp

Página 95 - Information

Quality and Reliability Requirements94 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Página 96 - F.1.2 Additional Suppliers

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 95Enabled Suppliers InformationFEnabled Suppliers InformationF.1 Supplier InformationF.1.1 Intel Ena

Página 97

Enabled Suppliers Information96 Quad-Core Intel® Xeon® Processor 5400 Series TMDGNote: CEK771-02-1U is the 1U alternative reference heatsink design fo

Página 98

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 97Enabled Suppliers InformationTable F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Proce

Página 99

Enabled Suppliers Information98 Quad-Core Intel® Xeon® Processor 5400 Series TMDG1U Heatsink Alternative CEK HeatsinkCopper Fin, Copper BaseAavidTherm

Página 100 - Enabled Suppliers Information

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 99Enabled Suppliers Information§

Comentários a estes Manuais

Sem comentários