HP E5440 Especificações descarregar pdf (Página 39)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 39

Thermal/Mechanical Reference Design

2.5.4 Assembly Overview of the Intel Reference Thermal

Mechanical Design

The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400

Series thermal performance targets are called the Common Enabling Kit (CEK)

heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the

following components:

• Heatsink (with captive standoff and screws)

• Thermal Interface Material (TIM)

•CEK Spring

2.5.4.1 Geometric Envelope

The baseboard keepout zones on the primary and secondary sides and height

restrictions under the enabling component region are shown in detail in Appendix B.

The overall volumetric keep in zone encapsulates the processor, socket, and the entire

thermal/mechanical enabling solution.

2.5.4.2 Assembly Drawing

Figure 2-16. Exploded View of CEK Thermal Solution Components

1 2 ... 34 35 36 37 38 39 40 41 42 43 44 ... 99 100

Sem comentários

HP E5440 Especificações Página 39