HP BL460c G6 Especificações Rápidas descarregar pdf (Página 17)

HP Memory

HP MemoryHP Memory

HP Memory

Registered DIMMS (RDIMMs)

Registered DIMMS (RDIMMs)Registered DIMMS (RDIMMs)

Registered DIMMS (RDIMMs)

HP 2GB (1x2GB) Dual Rank x8 PC3-10600 (DDR3-1333) Registered CAS-9 Memory

Kit

500656-B21

HP 4GB (1x4GB) Dual Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9 Memory

Kit

500658-B21

HP 4GB (1x4GB) Quad Rank x8 PC3-8500 (DDR3-1066) Registered CAS-7 Low

Power Memory Kit

500660-B21

HP 4GB (1x4GB) Single Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9

Memory Kit

593339-B21

HP 4GB (1x4GB) Single Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 Low

Power Memory Kit

NOTE:

NOTE:NOTE:

NOTE:

Low Voltage DIMMs can only be used with Intel Xeon 5600 series processors.

604504-B21

HP 8GB (1x8GB) Dual Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9 Memory

Kit

500662-B21

HP 8GB (1x8GB) Dual Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 Low

Power Memory Kit

NOTE:

NOTE:NOTE:

NOTE:

Low Voltage DIMMs can only be used with Intel Xeon 5600 series processors.

604506-B21

HP 16GB (1x16GB) Quad Rank x4 PC3-8500 (DDR3-1066) Registered CAS-7

Memory Kit

500666-B21

Unbuffered with ECC DIMMs (UDIMMs)

Unbuffered with ECC DIMMs (UDIMMs)Unbuffered with ECC DIMMs (UDIMMs)

Unbuffered with ECC DIMMs (UDIMMs)

HP 1GB (1x1GB) Single Rank x8 PC3-10600 (DDR3-1333) Unbuffered CAS-9

Memory Kit

500668-B21

HP 2GB (1x2GB) Dual Rank x8 PC3-10600 (DDR3-1333) Unbuffered CAS-9

Memory Kit

500670-B21

HP 4GB (1x4GB) Dual Rank x8 PC3-10600 (DDR3-1333) Unbuffered CAS-9

Memory Kit

500672-B21

NOTE:

NOTE:NOTE:

NOTE:

All DDR3 memory option kits consist of one DIMM per kit. For detailed

memory configuration rules and guidelines, please use the Online DDR3 Memory

Configuration Tool:

www.hp.com/go/ddr3memory-configurator

NOTE:

NOTE:NOTE:

NOTE:

Kits described as LP include Low Power DIMMs. For more information on

ProLiant Energy Efficient Features, see:

www.hp.com/go/proliant-energy-efficient

NOTE:

NOTE:NOTE:

NOTE:

PC3L is a low voltage memory.

Step 3: Choose Additional Options for Factory Integration

Step 3: Choose Additional Options for Factory IntegrationStep 3: Choose Additional Options for Factory Integration

Step 3: Choose Additional Options for Factory Integration

NOTE:

NOTE:NOTE:

NOTE:

For additional options, please refer to the "Core Options" and "Additional Options" section below. For additional options,

including server blade enclosures interconnect and mezzanine options and power subsystem options; please see the Core Options

and Additional sections below; or the following:

HP BladeSystem c-Class Enclosures QuickSpecs:

HP BladeSystem c3000 Enclosure QuickSpecs:

http://h18000.www1.hp.com/products/quickspecs/12790_div/12790_div.html

HP BladeSystem c7000 Enclosure QuickSpecs:

http://h18000.www1.hp.com/products/quickspecs/12810_div/12810_div.html

and HP BladeSystem c-Class Interconnect and Mezzanine Components:

http://h18004.www1.hp.com/products/blades/components/c-class-interconnects.html

http://h18004.www1.hp.com/products/blades/components/c-class-adapters.html

QuickSpecs

HP ProLiant BL460c Generation 6 (G6) Server Blade

HP ProLiant BL460c Generation 6 (G6) Server BladeHP ProLiant BL460c Generation 6 (G6) Server Blade

HP ProLiant BL460c Generation 6 (G6) Server Blade

Configuration Information - Factory Integrated Models

DA - 13238 Worldwide — Version 24 — May 11, 2011

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QuickSpecs 1

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