Hp ProLiant BL620c G7 Server-Blade Manual do Utilizador Página 95
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Troubleshooting 95
NOTE: For the location of server LEDs and information on their statuses, refer to the server
documentation.
Possible causes:
• Improperly seated or faulty internal or external component
• Unsupported component installed
• Redundancy failure
• System overtemperature condition
Item See
1
•
"Integrated Management Log (on page 75)" or in the HP ProLiant
Servers Troubleshooting Guide located on the Documentation CD or
see "Troubleshooting resources (on page 80)"
•
"Event list error messages" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or see "Troubleshooting
resources (on page 80)"
2
"Component identification (on page 7)"
3
System Management Homepage (https://localhost:2381)
4
"Power-on problems flowchart ("Server blade power-on problems
flowchart" on page 88)"
5
•
"Hardware problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or see "Troubleshooting
resources (on page 80)"
•
Maintenance and service guides for c-
Class server blades, located on
the Documentation CD or the HP website
(http://www.hp.com/go/bladesystem/documentation)
•
"HP contact information (on page 108)"
6
•
"Hardware problems" in the HP ProLiant Servers Troubleshooting
Guide located on the Documentation CD or see "Troubleshooting
resources (on page 80)"
•
Maintenance and service guides for c-
Class server blades, located on
the Documentation CD or the HP website
(http://www.hp.com/go/bladesystem/documentation)
- User Guide 1
- Contents 3
- Contents 4 4
- Contents 5 5
- Contents 6 6
- Component identification 7
- SAS and SATA hard drive LEDs 8
- System board components 9
- System maintenance switch 10
- Accessing the redundant ROM 11
- DIMM slot locations 12
- HP c-Class Blade SUV Cable 12
- Item Connector Description 13
- Operations 14
- Remove the server blade 15
- Remove the access panel 16
- Install the access panel 16
- Remove the left DIMM baffle 17
- Remove the right DIMM baffle 18
- Remove the battery pack 19
- Overview 21
- Remove the device bay blank 22
- Setup 23 23
- Setup 26 26
- Connecting to the network 27
- Installing a server blade 28
- Completing the configuration 29
- Introduction 30
- Processor option 30
- Memory option 36
- Dual- and quad-rank DIMMs 37
- DIMM identification 37
- DIMM installation guidelines 38
- Channel Slot Slot number 40
- Hemisphere mode 41
- Memory RAS 43
- HP Memory Quarantine 45
- Installing DIMMs 46
- Remove the hard drive blank 48
- Prepare the hard drive 48
- Mezzanine card option 49
- Controller options 51
- Installing a capacitor pack 53
- BitLocker™ enabled 57
- Additional TPM features 57
- Cabling 58
- Item Description 60
- Network-based PXE deployment 61
- Deployment overview 62
- Deployment infrastructure 62
- Deployment methods 63
- PXE deployment 64
- CD-ROM deployment 64
- Diskette image deployment 65
- SAN configuration 66
- Configuration tools 67
- HP ROM-Based Setup Utility 68
- Boot options 69
- BIOS Serial Console 69
- Configuring AMP modes 69
- Configuring mirrored memory 70
- Array Configuration Utility 71
- Management tools 72
- ROMPaq utility 73
- Erase Utility 73
- Redundant ROM support 74
- Diagnostic tools 75
- Keeping the system current 77
- Firmware 78
- HP Smart Update Manager 78
- Care Pack 79
- Troubleshooting 80
- Warnings 81
- Symbols on equipment 81
- Symptom information 82
- Troubleshooting 83 83
- Loose connections 84
- Service notifications 84
- Server health LEDs 84
- Troubleshooting flowcharts 84
- Start diagnosis flowchart 85
- General diagnosis flowchart 86
- Symptoms: 88
- POST problems flowchart 90
- OS boot problems flowchart 92
- • Corrupted OS 93
- • Redundancy failure 95
- (http://www.hp.com/support) 96
- Troubleshooting 97 97
- Battery replacement 98
- FCC rating label 99
- Class A equipment 99
- Class B equipment 99
- Modifications 100
- • EMC Directive 2004/108/EC 101
- Japanese notice 102
- BSMI notice 102
- Korean notice 102
- Battery replacement notice 103
- Chinese notice 103
- Laser compliance 103
- Wireless devices 104
- Japanese notices 105
- Taiwan notices 105
- Electrostatic discharge 106
- Specifications 107
- Technical support 108
- Technical support 109 109
- Customer Self Repair 110
- Technical support 111 111
- Reparo feito pelo cliente 112
- Technical support 113 113
- Technical support 114 114
- Technical support 115 115
- Acronyms and abbreviations 116
- Index 119 119
- Index 120 120
- Index 121 121
- Index 122 122
- Index 123 123
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