Hp DM4 Manual do Utilizador Página 84

  • Descarregar
  • Adicionar aos meus manuais
  • Imprimir
  • Página
    / 113
  • Índice
  • MARCADORES
  • Avaliado. / 5. Com base em avaliações de clientes
Vista de página 83
7. Remove the fan/heat sink assembly (2).
The thermal material must be thoroughly cleaned from the surface of the processor component (1)
and the fan/heat sink assembly (2) each time the fan/heat sink assembly is removed. Thermal pads
and thermal paste must be installed on all surfaces before the fan/heat sink assembly is reinstalled.
NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with UMA graphics
subsystems.
Reverse this procedure to install the fan/heat sink assembly.
76 Chapter 4 Removal and replacement procedures
Vista de página 83
1 2 ... 79 80 81 82 83 84 85 86 87 88 89 ... 112 113

Comentários a estes Manuais

Sem comentários