HP DV3 Informações Técnicas descarregar pdf (Página 77)

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly and the system board each time the fan/heat sink assembly is removed:

●

Thermal paste is used on the processor (1) and the heat sink section (2) that services it

●

Thermal pads are used on the graphics subsystem chip (3) and the heat sink section (4) that

services it

Replacement thermal material is included with all fan/heat sink assembly, system board, and

processor spare part kits.

Reverse this procedure to install the fan/heat sink assembly.

Component replacement procedures 67

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HP DV3 Informações Técnicas Página 77