HP Apollo 9000 400t Manual de Serviço Página 5
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Emissions Regulations Compliance
Any third-party I/O device installed in HP Apollo system(s) must be in accordance with the
requirements set forth in the preceding Emissions Regulations statements. In the event that a
third-party noncompliant I/O device is installed, the customer assumes all responsibility
and liability arising therefrom.
Compliance to these regulations requires the use of shielded cables.
Electrostatic Discharge (ESD) Precautions
Electrostatic charges can damage the integrated circuits on printed circuit boards. To pre-
vent such damage from occurring, observe the following precautions during board unpack-
ing and installation:
• Stand on a static-free mat.
• Wear a static strap to ensure that any accumulated electrostatic charge will be dis-
charged from your body to ground.
• Connect all equipment together, including the static-free mat, static strap,
routing nodes, and peripheral units.
• Keep uninstalled printed circuit boards in their protective antistatic bags.
• Handle printed circuit boards by their edges, once you have removed them from their
protective antistatic bags.
- Series 400 Workstations 1
- Emissions Regulations 3
- VCCI Class 1 ITE Equipment 4
- VCCI Class 2 ITE Equipment 4
- Preface 7
- Audience 8
- Domain/OS Related Manuals 8
- HP-UX Related Manuals 9
- Documentation Conventions 10
- Contents 11
- Contents xiii 13
- Domain/OS Systems 15
- Contents xvii 17
- Contents xix 19
- Procedures 21
- Chapter 1 23
- 1.1 Introduction 24
- 1-4 Product Overview 26
- 1.2 Physical Configuration 27
- 1-8 Product Overview 30
- 1.5 Introduction 31
- 1.6 Physical Configuration 33
- 1-16 Product Overview 38
- Chapter 2 41
- 2-2 System Controls 42
- System Controls 2-3 43
- 2.2 Monitor Controls 46
- System Controls 2-7 47
- 2-8 System Controls 48
- 2.3 LED Indicator Lights 49
- Chapter 3 51
- 3-4 Theory of Operation 54
- Theory of Operation 3-5 55
- 3-6 Theory of Operation 56
- Theory of Operation 3-7 57
- 3-8 Theory of Operation 58
- 3.2 FRU-Level Operation 59
- Uncorrectable Memory Error 65
- 3-20 Theory of Operation 70
- Chapter 4 71
- Compatible Mode 73
- 4-4 Fault Isolation 74
- Figure 4-1. Main Flowchart 74
- Fault Isolation 4-5 75
- 4-6 Fault Isolation 76
- Fault Isolation 4-7 77
- 4-8 Fault Isolation 78
- Fault Isolation 4-9 79
- 4-10 Fault Isolation 80
- Fault Isolation 4-11 81
- 4-12 Fault Isolation 82
- Fault Isolation 4-13 83
- 4-16 Fault Isolation 86
- 4.3 Mnemonic Debugger Level 87
- 4-22 Fault Isolation 92
- 4.4 The sysboot Program 95
- 4.5 Online Level 96
- Fault Isolation 4-29 99
- 4-30 Fault Isolation 100
- Fault Isolation 4-31 101
- 4.9 Boot ROM Self-Tests 108
- Fault Isolation 4-43 113
- Fault Isolation 4-45 115
- Fault Isolation 4-47 117
- Fault Isolation 4-49 119
- 4.10 Test Mode 122
- CONTINUE AT OWN RISK 123
- RETURN To Continue 123
- Memory Failed at (address) 124
- (W:BBCCDDEE, R:BBCCDDEF) 124
- PARITY BIT ERROR AT (address) 124
- 4-56 Fault Isolation 126
- Fault Isolation 4-57 127
- Part 3 Checkout Procedures 130
- Fault Isolation 4-61 131
- 4-62 Fault Isolation 132
- Fault Isolation 4-67 137
- J001 14 137
- Domain Compatible Mode 139
- Compatible Mode 147
- Chapter 5 149
- 5.3 System Assemblies 150
- 5.5 System Unit Assemblies 172
- (Continued) 227
- Appendix A 235
- A-2 FRU Confi gurations 236
- A-6 FRU Confi gurations 240
- FRU Confi gurations A-7 241
- FRU Confi gurations A-11 245
- Hard Disk Drive 245
- A-12 FRU Confi gurations 246
- Tape Drive 246
- FRU Confi gurations A-13 247
- A-14 FRU Confi gurations 248
- Appendix B 249
- Appendix C 253
- C-2 Confi guring the EEPROM 254
- C.4 I/O Configuration Mode 264
- Configure Mode Failed 265
- Configuration EEPROM Failed 265
- 1 Select Code 9 268
- used select codes are : 268
- 12 14 15 21 268
- C.5 Auto System Select Mode 277
- Appendix D 283
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