HP B160L Manual do Utilizador Página 304

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HP Integrity rx5670 Internals
6. Two PCI-X 64/66 I/O slots on one channel 0.5GB/s
7. One PCI 64/66 slot for Gigabit Ethernet and one SCSI controller (Core I/O) on one channel
0.5GB/s
8. One PCI 64/66 slot for management LAN, serial and one SCSI controller (Core I/O); and
one PCI 64/33 slot for optional graphics/USB on one channel (with the other slot) 0.5GB/s
The I/O connectivity part of the chipset is made up of standard third-party I/O chips, implemented on
Core I/O cards in two or three PCI slots
Dual-channel Ultra160 SCSI controllers (LSI 53C1010)
SCSI controller (LSI 53C896)
Gigabit Ethernet (Broadcom 5701)
Serial controller, DUART (16550A-compatible)
IBM PCI-X to PCI-X bridge
“Diva” remote management processor serial and LAN
Optional Radeon VGA graphics (with USB on one card)
Optional EHCI USB controller
Buses
Itanium 2/zx1 processor bus 6.4GB/s at 200MHz DDR
Two independent zx1 memory buses, 266MHz, each 6.4GB/s aggregate 12.8GB/s memory
bandwidth
Eight zx1 I/O channels/buses, aggregate 4.0GB/s
Three PCI-X 64/133 I/O buses for expansions slots
Three PCI-X 64/66 I/O buses for expansion slots
PCI-X 64/66 I/O bus for Core I/O expansion slots
PCI 64/33 I/O bus for graphics/USB slot
Two SCSI-3 Ultra160 (LVD) storage I/O buses
Memory
PC2100 ECC DDR CL2 SDRAM DIMMs
Takes up to 2GB modules
One or two 24-DIMM memory carrier boards
DIMMs must be installed in quads
1GB minimum (4×256MB)
96GB maximum with two 24-DIMM boards (48×2GB)
12.8GB/s memory bandwidth
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