
PA-RISC Chipsets Memory and I/O Controller (MIOC)
Details
Also called Memory and I/O controller (MIOC), Processor Memory Interface (PMI) and Proces-
sor Interface Chip (PIC)
On SMP systems two connections strategies supported: Each CPU has its own MIOC which share
a SMB bus and memory, or two CPUs share one MIOC
9,5×9,5 mm
2
die, 185,000 FETs, 0.8µ(micron), CMOS (CMOS26B) in 272-pin CPGA
SBI: two 100-pin QFP chips
Viper was implemented in a low-cost version on the 705/710 workstations: two separate chips,
each 7,0×7,0 mm
2
die, 1.0µ(micron), two-layer metal CMOS (CMOS34) in 160-pin QFP
Viper (PA-7000) chip numbers: 1FV8-0002
References
1. Midrange PA-RISC Workstations with Price/Performance Leadership
65
(.pdf) pp. 6-11 Andrew
J. DeBaets and Kathleen M. Wheeler (August 1992: Hewlett-Packard Journal)
2. VLSI Circuits for Low-End and Midrange PA-RISC Computers
66
(.pdf) pp. 12-22 Craig A. Glea-
son (August 1992: Hewlett-Packard Journal)
3. High-Performance Design for Low-Cost PA-RISC Desktops
67
(.pdf) pp. 56-63 Craig Fink et al
(August 1992: Hewlett-Packard Journal)
2.4.9 Memory and I/O Controller (MIOC)
The Memory and I/O Controller in the PA-7100LC processor and PA-7300LC processor is the integra-
tion of both DRAM/cache controller and I/O controller on the processor die. It is very similar on both
CPUs, not much has been changed in the transition from 7100LC to 7300LC.
The integrated memory controller requires only buffers and DRAM modules to build up the complete
memory subsystem.
Execution units and internal caches attach on-chip to the MIOC
External cache (L1 on PA-7100LC, L2 on PA-7300LC) attach to MIOC via 64-bit (PA-7100LC)
or 128-bit (PA-7300LC), both with ECC
Memory attaches to MIOC via 64-bit (on PA-7100LC) or 128-bit (PA-7300LC), with ECC
On PA-7300LC memory lines use the L2 cache data lines
GSC, the system main bus attaches to MIOC
On PA-7300, GSC+ system main bus
Support for 4, 16, 64 and 256 Mbit modules
Support for both FPM and EDO DRAM
65
http://www.hpl.hp.com/hpjournal/pdfs/IssuePDFs/1992-08.pdf
66
http://www.hpl.hp.com/hpjournal/pdfs/IssuePDFs/1992-08.pdf
67
http://www.hpl.hp.com/hpjournal/pdfs/IssuePDFs/1992-08.pdf
54
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