HP B160L Manual do Utilizador Página 56

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PA-RISC Chipsets Wax
Parallel WD16C522 compatible
Audio Harmony CD-quality 16-bit sound
Telephony optional expansion, support for two lines
Human Interface support for two PS/2 style keyboard and mouse devices
FDD and boot ROM external 8-bit bus to connect flash EPROMs and a FDD controller
(WD37C65C)
Interface to GSC bus
Bus arbitration
Interrupt controller
Real-Time clock (RTC)
PLL generator for the whole I/O subsystem
Up to four LASI chips can be used on a single GSC bus (however apparently never implemented)
Supports both 3.3V and 5.0V PCI operation
13.2×12.0 mm
2
die, 520,000 FETs, 0.8µ(micron), CMOS (HP CMOS26B process), packaged in
240-pin MQUAD
3W power consumption at 40MHz
References
1. 712 I/O Subsystem ERS (External Reference Specification) “LASI ERS”
59
Hewlett-Packard
Company (February 1993, Revision 1.1)
2. An I/O System on a Chip
60
Thomas V. Spencer et al (April 1995, Hewlett-Packard Journal)
2.4.4 Wax
Used in
715, 725
743i, 745, 744, 748i
B132L, B132L+, B160L, B180L+
C100, C110, C132L, C160L, C160, C180, C200, C240, C360
D-Class
E25, E35, E45, E55
J200, J210, J210XC, J280, J282, J2240
R380, R390
59
http://ftp.parisc-linux.org/docs/chips/lasi_ers.pdf
60
http://www.hpl.hp.com/hpjournal/95apr/apr95a4.pdf
49
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